SOFTWARE / Moldex3D / eDsign / Warp
Based on the filling, packing and cooling analyses by Moldex3D Flow, Pack, Cool, Moldex3D Warp allows users to perform true 3D warpage analysis on thick parts and those parts that have extreme thickness changes. With Warp, users can easily and efficiently improve the part quality and optimize design. For fiber-filled material, Warp incorporates fiber composite theories and the fiber orientation results from Fiber to predict its anisotropic shrinkage and warpage. Furthermore, Warp links with I2 modules to interface with structural analysis software.
  • Evaluate final part shape before actual molding
  • Evaluate both single cavity and multi-cavity molds
  • Evaluate unbalanced cooling effect on warpage
  • Evaluate volumetric shrinkage effect on warpage
  • Evaluate molecular and/or fiber orientation effect on warpage (Moldex3D Fiber module is required to predict fiber orientation)
  • Evaluate in-mold constraint effect on warpage
  • Evaluate moldbase thermal deformation effect
  • Evaluate thermally induced residual stress
  • Query any two points to determine the linear shrinkage ratio between two locations
  • Define an arbitrary reference plane for easy measurement of deflection
  • Separate total displacement into x-axis, y-axis, and z-axis displacements to show the deformation in each direction
  • Export warpage shape in STL format or Moldex3D Mesh format for further study
  • Export inverse warpage shape in STL format or Moldex3D Mesh format for further study
Part warpage analysis
  • Calculate final part shape due to material shrinkage as the temperature and pressure changes from the process settings to room conditions
Residual stress analysis
  • Calculate solid temperature distribution within mold base, insert and cooling circuit
  • Calculate the cooling circuit efficiency
  • Calculate part insert effects (Moldex3D MCM module is required)
  • Calculate mold insert of different materials, such as beryllium copper.
  • Calculate heating rod effects
Material anisotropic analysis
  • Anisotropic properties are calculated based on the material orientation tensors obtained from flow analysis
  • Anisotropic properties are transferred to general structure CAE software for analyzing the part structure with process-induced properties.
In-mold constraint effect analysis
  • Before the part is ejected, the deformation of warpage has been developed inside the mold. However, it cannot shrink and deform freely due to constraints by the rigid mold.
  • Calculate the in-mold constraint induced part warpage to enhance the analysis accuracy.