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SOFTWARE / Moldex3D / eDsign / RIM
 
RIM
Based on the filling, packing and cooling analyses by Moldex3D Flow, Pack, Cool, Moldex3D Warp allows users to perform true 3D warpage analysis on thick parts and those parts that have extreme thickness changes. With Warp, users can easily and efficiently improve the part quality and optimize design. For fiber-filled material, Warp incorporates fiber composite theories and the fiber orientation results from Fiber to predict its anisotropic shrinkage and warpage. Furthermore, Warp links with I2 modules to interface with structural analysis software.
 
Capabilities
  • Predict the melt front advancement to see how the mold fills
  • Predict 3D fountain flow phenomena, inertia phenomena, and viscosity heating effects
  • Predict the injection pressure and evaluate the requirement of clamping force
  • Predict the conversion variation in molding process
  • Predict weld line locations to minimize or eliminate them
  • Predict air traps and identify short shot problems
  • Optimize gate design to minimize weld lines and achieve balanced filling
  • Optimize process conditions in filling stage, such as injection time, melt temperature, ram speed profile, curing time, etc
  • Simulate filling process for multi-cavity molds or family molds
 
Features
Mold filling analysis
  • Melt front time prediction
  • Pressure
  • Temperature
  • Shear stress
  • Shear rate
  • Velocities in X, Y, Z
  • Conversion
  • Density
  • Scorch Index
  • Total velocity
  • Velocity vector field
  • Sprue pressure variation during filling process
  • Clamping force of mold in X, Y, Z directions
  • Flow rate variation during filling process
Curing analysis
  • Pressure
  • Temperature
  • Mass flow rate
  • Shear stress
  • Shear rate
  • Conversion
  • Density
  • Velocity vector
Clamping force prediction
Gate design evaluation
  • Gate location
  • Gate type
  • Gate size
Weld-lines prediction
Air trap location prediction
Runner design evaluation
  • Runner layout
  • Runner size
  • Runner type
Warpage problem prediction
  • Evaluate final part shape before actual molding
  • Evaluate fiber orientation effect on warpage
  • Separate total displacement into x-axis, y-axis, and z-axis displacements to show the deformation in each direction
Fiber orientation evaluation
  • Predict 3D fiber orientation and thermo-mechanical property distributions
  • Model the fiber length, diameter and concentration in evaluating fiber orientation, shrinkage and warpage
Simulate microchip encapsulation process
Link to InPack to simulate wire sweep for microchip encapsulation
Link to InPack to simulate paddle shift for microchip encapsulation
 
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